Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Microphone Condenser
Sensitivity
1dB
Directivity
Omni-Directional
Standard Operating Voltage
3.6V dc
Mount Type
Surface
Signal to Noise Ratio
65.5dB
Maximum Frequency
3.3MHz
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Minimum Frequency
1.5MHz
Height
0.98mm
Standards/Approvals
No
Series
MP23DB01HP
Product Details
The STMicroelectronics MP23DB01HP is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC Interface with stereo operation capability. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors. The IC Interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
Stock information temporarily unavailable.
€ 6.61
€ 1.322 Each (In a Pack of 5) (ex VAT)
Standard
5
€ 6.61
€ 1.322 Each (In a Pack of 5) (ex VAT)
Stock information temporarily unavailable.
Standard
5
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 45 | € 1.322 | € 6.61 |
| 50 - 245 | € 1.256 | € 6.28 |
| 250 - 495 | € 1.24 | € 6.20 |
| 500+ | € 1.226 | € 6.13 |
Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Microphone Condenser
Sensitivity
1dB
Directivity
Omni-Directional
Standard Operating Voltage
3.6V dc
Mount Type
Surface
Signal to Noise Ratio
65.5dB
Maximum Frequency
3.3MHz
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Minimum Frequency
1.5MHz
Height
0.98mm
Standards/Approvals
No
Series
MP23DB01HP
Product Details
The STMicroelectronics MP23DB01HP is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC Interface with stereo operation capability. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors. The IC Interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.