Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
68µF
Voltage
4V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Maximum Operating Temperature
+105°C
Height
1.9mm
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
27.2 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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€ 0.396
Each (In a Pack of 10) (ex VAT)
10
€ 0.396
Each (In a Pack of 10) (ex VAT)
10
Buy in bulk
quantity | Unit price | Per Pack |
---|---|---|
10 - 90 | € 0.396 | € 3.96 |
100 - 240 | € 0.296 | € 2.96 |
250 - 490 | € 0.288 | € 2.88 |
500 - 990 | € 0.28 | € 2.80 |
1000+ | € 0.272 | € 2.72 |
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
68µF
Voltage
4V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Maximum Operating Temperature
+105°C
Height
1.9mm
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
27.2 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets