Technical Document
Specifications
Brand
SamtecNumber of Contacts
100
Product Type
PCB Socket
Number of Rows
2
Sub Type
Board-to-Board
Pitch
0.8mm
Current
1.4A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18mm
Connector System
Board-to-Board
Voltage
200 V
Series
ERF8
Minimum Operating Temperature
-55°C
Row Pitch
4.5mm
Maximum Operating Temperature
125°C
Contact Material
Beryllium Copper Alloy
Contact Plating
Gold
Standards/Approvals
No
Product details
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.
Insulator material: Black LCP
Operating temperature: -55 → 125 °C
0.8mm Board to Board - Samtec
Stock information temporarily unavailable.
€ 8.88
€ 8.88 Each (ex VAT)
Standard
1
€ 8.88
€ 8.88 Each (ex VAT)
Stock information temporarily unavailable.
Standard
1
Technical Document
Specifications
Brand
SamtecNumber of Contacts
100
Product Type
PCB Socket
Number of Rows
2
Sub Type
Board-to-Board
Pitch
0.8mm
Current
1.4A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18mm
Connector System
Board-to-Board
Voltage
200 V
Series
ERF8
Minimum Operating Temperature
-55°C
Row Pitch
4.5mm
Maximum Operating Temperature
125°C
Contact Material
Beryllium Copper Alloy
Contact Plating
Gold
Standards/Approvals
No
Product details
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.
Insulator material: Black LCP
Operating temperature: -55 → 125 °C


