Bergquist Self-Adhesive Thermal Interface Sheet, 0.02in Thick, 0.9W/m·K, Polymer, 200 x 100mm
Technical Document
Specifications
Brand
BergquistDimensions
200 x 100mm
Thickness
0.02in
Length
200mm
Width
100mm
Thermal Conductivity
0.9W/m·K
Material
Polymer
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+125°C
Hardness
Shore OO 40
Operating Temperature Range
-60 → +125 °C
Country of Origin
United States
Product details
Gap Pad® 1000SF
Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating
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€ 52.00
Each (ex VAT)
1
€ 52.00
Each (ex VAT)
1
Buy in bulk
| quantity | Unit price |
|---|---|
| 1 - 9 | € 52.00 |
| 10 - 24 | € 49.45 |
| 25 - 49 | € 46.84 |
| 50 - 99 | € 44.20 |
| 100+ | € 41.59 |
Technical Document
Specifications
Brand
BergquistDimensions
200 x 100mm
Thickness
0.02in
Length
200mm
Width
100mm
Thermal Conductivity
0.9W/m·K
Material
Polymer
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+125°C
Hardness
Shore OO 40
Operating Temperature Range
-60 → +125 °C
Country of Origin
United States
Product details
Gap Pad® 1000SF
Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating