Technical Document
Specifications
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.03mm²
Termination Method
Crimp
Maximum Wire Size mm²
0.09mm²
Contact Plating
Tin
Minimum Wire Size AWG
32AWG
Contact Material
Phosphor Bronze
Maximum Wire Size AWG
28AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Product details
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
For suitable Crimp Tool for 668-9713, 668-9716, 668-9719, 668-9722 and 778-0974 see stock number 233-0044
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
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€ 0.198
Each (Supplied in a Bag) (ex VAT)
100
€ 0.198
Each (Supplied in a Bag) (ex VAT)
100
Buy in bulk
quantity | Unit price | Per Bag |
---|---|---|
100 - 400 | € 0.198 | € 19.76 |
500 - 900 | € 0.167 | € 16.72 |
1000 - 2400 | € 0.149 | € 14.85 |
2500 - 4900 | € 0.129 | € 12.86 |
5000+ | € 0.118 | € 11.81 |
Technical Document
Specifications
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.03mm²
Termination Method
Crimp
Maximum Wire Size mm²
0.09mm²
Contact Plating
Tin
Minimum Wire Size AWG
32AWG
Contact Material
Phosphor Bronze
Maximum Wire Size AWG
28AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Product details
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
For suitable Crimp Tool for 668-9713, 668-9716, 668-9719, 668-9722 and 778-0974 see stock number 233-0044
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.