Technical Document
Specifications
Electrolyte Type
Solid
Tolerance Minus
-20%
Minimum Operating Temperature
-55°C
Tolerance Plus
+20%
Length
1.6mm
Depth
0.85mm
Maximum Operating Temperature
+125°C
Terminal Type
Surface Mount
Height
0.85mm
Technology
MnO2
Mounting Type
Surface Mount
Tolerance
±20%
Leakage Current
0.5 μA
Voltage
16V dc
Capacitance
2.2µF
Dissipation Factor
10%
Brand
AVXDimensions
1.6 x 0.85 x 0.85mm
Equivalent Series Resistance
7.5Ω
Package/Case
1608-10
Series
TAC
Product details
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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P.O.A.
5
P.O.A.
5
Technical Document
Specifications
Electrolyte Type
Solid
Tolerance Minus
-20%
Minimum Operating Temperature
-55°C
Tolerance Plus
+20%
Length
1.6mm
Depth
0.85mm
Maximum Operating Temperature
+125°C
Terminal Type
Surface Mount
Height
0.85mm
Technology
MnO2
Mounting Type
Surface Mount
Tolerance
±20%
Leakage Current
0.5 μA
Voltage
16V dc
Capacitance
2.2µF
Dissipation Factor
10%
Brand
AVXDimensions
1.6 x 0.85 x 0.85mm
Equivalent Series Resistance
7.5Ω
Package/Case
1608-10
Series
TAC
Product details
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.