Technical Document
Specifications
For Use With
Universal Square Alu
Length
26mm
Width
26mm
Height
12mm
Dimensions
26 x 26 x 12mm
Thermal Resistance
10.8K/W
Mounting
Wire Clip
Package Type
BGA
Material
Aluminium
Country of Origin
China
Product details
CCI Chipset Heatsink
Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.
Mechanical fixing (variation between heat sinks)
Developed for mass production and high volume applications, where combination of cost and performance is critical
Integrated interface material (check heat sink) for complete solution
Ideally suited for both natural and forced convection
BGA Heatsinks
Stock information temporarily unavailable.
Please check again later.
P.O.A.
1
P.O.A.
1
Technical Document
Specifications
For Use With
Universal Square Alu
Length
26mm
Width
26mm
Height
12mm
Dimensions
26 x 26 x 12mm
Thermal Resistance
10.8K/W
Mounting
Wire Clip
Package Type
BGA
Material
Aluminium
Country of Origin
China
Product details
CCI Chipset Heatsink
Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.
Mechanical fixing (variation between heat sinks)
Developed for mass production and high volume applications, where combination of cost and performance is critical
Integrated interface material (check heat sink) for complete solution
Ideally suited for both natural and forced convection